Recently, China Zhongji Investment completed a targeted investment in Tongfu Microelectronics Co., Ltd. (Abbreviated as: Tongfu Microelectronics, Stock Code: 002156). Established in 1997 and headquartered in Nantong, Jiangsu, Tongfu Microelectronics was listed on the Shenzhen Stock Exchange in 2007. It is one of the three giants in China's chip packaging and testing field.
Established for more than 20 years, Tongfu Microelectronics has been deeply involved in the semiconductor field, specializing in integrated circuit packaging and testing. It has six major production bases: the headquarters factory, Nantong Tongfu, Hefei Tongfu, Tongfu Superway Suzhou, Tongfu Superway Penang, and Xiamen Tongfu. It has become a leading domestic semiconductor multinational group company and a leading enterprise in China's integrated circuit packaging and testing industry. Currently, Tongfu Microelectronics ranks among the top ten packaging companies globally and is the second largest packaging and testing manufacturer in China in terms of revenue.
As a national high-tech enterprise, Tongfu Microelectronics has undertaken numerous national-level technological transformation and scientific research projects, continuously achieving fruitful technological innovation results, and actively carrying out domestic and international patent layouts in several advanced packaging technology fields. The company's packaging technologies and related products have been widely used in high-end processor chips (CPU, GPU), memory, Internet of Things, power modules, and automotive electronics.
In terms of market, Tongfu Microelectronics has been actively involved in international layout since its inception, actively integrating into the global semiconductor industry chain, accumulating rich international market development experience, and through mergers and acquisitions, forming a strong alliance with AMD in a "joint venture + cooperation" model, binding AMD as a high-quality major customer. At the same time, the company makes full use of the TF-AMD Suzhou and TF-AMD Penang high-end CPU and GPU mass production packaging and testing platforms to actively undertake high-end packaging and testing business from domestic and foreign customers. Currently, more than 50% of the world's top 20 semiconductor companies and the vast majority of well-known domestic integrated circuit design companies have become the company's customers.
In recent years, Tongfu Microelectronics has seized industry development opportunities and adopted a model that combines endogenous development and merger and acquisition-based external expansion to promote the company's product structure adjustment and transformation and upgrading. The company's main production bases have expanded from the previous Chongchuan headquarters in Nantong to five production bases in Chongchuan, Sutong, Hefei, Suzhou, and Penang, Malaysia, and has also established a presence in Xiamen through equity participation, creating a multi-point blooming situation. Production capacity has increased exponentially, especially the significant increase in advanced packaging capacity, resulting in a more obvious scale advantage.
Yang Xiaoying, Partner and Managing Director of China Zhongji Investment, said that the global packaging and testing industry is still in an upward stage, and the domestic packaging and testing market is expanding at an even faster pace than internationally, with the process of domestic substitution accelerating. Tongfu Microelectronics, as a leading enterprise in China's integrated circuit packaging and testing industry, has outstanding advantages in terms of technology accumulation and market layout, and has considerable growth potential. We have also secured a high "margin of safety," and believe that this investment will bring stable returns.
