Recently, China Zhongji Investment completed a targeted investment in Suzhou Jingfang Semiconductor Technology Co., Ltd. (hereinafter referred to as Jingfang Technology, stock code: 603005.SH). Jingfang Technology is one of the leading domestic semiconductor wafer-level packaging companies, the first in mainland China and the second largest globally to provide wafer-level chip-size packaging (WLCSP) mass production services for image sensor chips.
Other participants in this targeted increase include CICC, Caotong Fund, Shanghai State-owned Enterprise Reform and Development Equity Investment Fund, and Suzhou Industrial Park Equity Investment Fund. The raised funds will be used for the 12-inch TSV integrated circuit and heterogeneous integration intelligent sensor module project, mainly focusing on the two product areas of image sensors and biometric identification sensors.
Established in 2005, Jingfang Technology has been committed to developing and innovating new technologies to provide customers with reliable, miniaturized, high-performance, and cost-effective semiconductor packaging mass production services. The company is one of the few companies worldwide that has mastered wafer-level chip-size packaging (WLCSP) technology. Its CMOS image sensor wafer-level packaging technology makes high-performance, miniaturized mobile phone camera modules possible, with nearly 50% of existing image sensor chips using this technology. The company is also a global developer of 12-inch wafer-level chip-size packaging technology, with mass production capabilities for 8-inch and 12-inch wafer-level chip-size packaging technology.
Currently, Jingfang Technology's packaged products mainly include image sensor chips (consumer electronics such as mobile phones, tablets, and computers, security, automotive, etc.), biometric identification chips (capacitive fingerprint recognition, under-screen optical fingerprint, etc.), 3D sensing chips (TOF, structured light, etc.), and MEMS chips (inertial sensors, micro-mirrors, etc.), with related products widely used in smartphones, security digital products, automotive electronics, medical electronics, and many other fields.
Since its establishment, Jingfang Technology has continuously invested in technological research and development, undertaking multiple major national science and technology projects, all focusing on wafer-level packaging. Its technological advantages are widely recognized in the industry. While maintaining technological independence and innovation, the company is also actively pursuing global intellectual property layout, establishing a complete intellectual property system in the sensor field. It has been granted 203 patents in China and 136 patents in the United States and other countries.
In terms of customers, Jingfang Technology's main customers include the top CMOS sensor suppliers globally. Through its technological capabilities and service standards, the company has built long-term and close upstream and downstream industrial chain cooperation relationships with core domestic and international customers. This win-win relationship provides a strong guarantee for the company's sustainable development.
Yang Xiaoying, Partner and Managing Director of China Zhongji Investment, stated that with the rapid development of consumer electronics, Internet of Things technology, intelligent manufacturing, autonomous driving, and 3D sensing technologies, the technical requirements for their key components—semiconductor sensors—are constantly improving, and wafer-level packaging technology will inevitably become mainstream. As a leader in this technology, Jingfang Technology occupies a technological first-mover advantage, scale advantage, and customer advantage. With the continuous expansion of the market space, under the advantages of technology and scale, the company's leading position is stable, and sustained high growth is expected. This investment is believed to bring good returns to investors.
