China Zhongji Investment completes targeted investment in "Saiwei Electronics"
Recently, China Zhongji Investment completed a targeted investment in Beijing Saiwei Electronics Co., Ltd. (hereinafter referred to as "Saiwei Electronics" or "the Company", stock code: 300456).
Saiwei Electronics focuses on semiconductor businesses, targeting the Internet of Things and artificial intelligence era. On the one hand, it focuses on the development of MEMS processes and wafer manufacturing, and on the other hand, it is actively deploying GaN materials and devices, aiming to become a globally renowned semiconductor technology group. The company's main products and businesses currently include MEMS chip process development and wafer manufacturing, GaN epitaxial material growth and device design, with downstream applications including communications, biomedicine, industrial science, and consumer electronics. The company's business spans the globe, serving clients including global giants in DNA/RNA sequencing instruments, new ultrasound equipment, network communication and applications, and leading companies in industrial and consumer segments. Wu Fushun, Partner and Managing Director of China Zhongji Investment, stated that MEMS and GaN are industries encouraged by the state and are also cutting-edge scientific research areas in the country's 14th Five-Year Plan, with broad development prospects. In the MEMS field, Saiwei Electronics has a global competitive advantage. Its wholly-owned subsidiary in Sweden, Silex, has long focused on MEMS chip process development and wafer manufacturing, possessing world-leading pure MEMS foundry technology and expanding foundry capacity. Silex has consistently ranked first globally among MEMS foundries for the past two years. In the GaN field, the chip manufacturing production line in which the company has a stake is under construction, with a planned capacity of 5,000 6-8 inch GaN chip wafers per month. The funds raised from this targeted increase will be used for expansion projects—an 8-inch MEMS international foundry line construction project, a packaging and testing project—MEMS advanced packaging and testing R&D and production line construction project, and a process development project—MEMS high-frequency communication device manufacturing process development project.
