China Zhongji Investment completed a targeted investment in "Huatian Technology"
Recently, China Zhongji Investment completed a targeted investment in Tianshui Huatian Technology Co., Ltd. (hereinafter referred to as "Huatian Technology" or "the Company," stock code: 002185.SZ). The funds raised from this targeted increase will be used to expand the scale of multi-chip packaging for integrated circuits, expand the scale of high-density system-level integrated circuit packaging and testing, industrialize TSV and FC integrated circuit packaging and testing, and industrialize storage and radio frequency integrated circuit packaging and testing.
The company mainly engages in the packaging and testing of semiconductor integrated circuits. Currently, the company's integrated circuit packaging products mainly include DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, BGA/LGA, FC, MCM (MCP), SiP, WLP, TSV, Bumping, MEMS, and other series. The products are mainly used in electronic complete machines and intelligent fields such as computers, network communications, consumer electronics and intelligent mobile terminals, the Internet of Things, industrial automation control, and automotive electronics. The company's annual integrated circuit packaging scale and sales revenue rank third among listed companies in the same industry in China. In recent years, the company has continuously strengthened the research and development of advanced packaging technologies and products, increased R&D investment, improved the construction of the R&D simulation platform mainly based in Xi'an, Huatian, and relied on national-level enterprise technology centers, Gansu Provincial Microelectronics Engineering Technology Research Center, and Gansu Provincial Microelectronics Engineering Laboratory and other R&D verification platforms. Through the implementation of national major science and technology projects (Project 02) and other scientific and technological innovation projects, as well as the continuous research and development of new products, new technologies, and new processes, the company has independently developed a number of advanced integrated circuit packaging technologies and products such as FC, Bumping, MEMS, MCM (MCP), WLP, SiP, TSV, and Fan-Out. As the company further increases its investment in technological innovation, its technological competitive advantage will continue to improve. Wu Fushun, Partner and Managing Director of China Zhongji Investment, said that the company is the third largest packaging and testing factory in China and the sixth largest in the world, and its operating capabilities have long been ranked first. The company has five major production bases in Tianshui, Xi'an, Kunshan, Nanjing, and Unisem. Through internal and external expansion, it has completed the "low-medium-high" capacity layout, expansion is prudent, and profitability is strong. Coupled with the prosperity of the semiconductor industry and the implementation of this fundraising project, the company's development is expected to reach new heights.
